PULSE GENERATOR MODULES

ECLPGM-XX

10K ECL Pulse Generator Module

- ECL input and outputs
- Pulse widths stable and precise
- 16-pin DIP package (.250 high)
- Available in pulse widths from 5 to l00ns

DESIGN NOTES

The "DIP series" Pulse Generator Modules developed by Engineered Components Company have been designed to provide precise output pulse widths when triggered by variable width inputs. All required driving and output circuitry, as well as timing components, are contained in a 16-pin DIP package. These Pulse Generator Modules are of hybrid construction utilizing the proven technologies of active integrated circuitry and of passive networks utilizing capacitive, inductive and resistive elements. The ICs utilized in these modules, are burned-in to level B of MIL-STD-883 to ensure a high MTBF. The MTBF on these modules, when calculated per MIL-HDBK-217 for a 50°C ground fixed environment, is in excess of 1.5 million hours. These modules are compatible with ECL 10,000 circuits and require no external components in order to obtain the specified output pulse.

The ECLPGM is available in 20 pulse widths from 5 to l00ns. These modules provide a stable positive as well as negative ECL 10,000 output pulse of the specified width for each positive input step. It is necessary only that the input step be held positive for at least 10ns in order to obtain the desired output pulse. The duration of the positive input pulse, after this time, has no effect on output pulse width. No output pulse will occur on the negative input pulse transition. Pulse width tolerance is maintained as shown in the accompanying Part Number Table, when tested under the "Test Conditions" shown. Pulse width is measured at the -1.3V level on both leading and trailing edge. Rise and fall times are less than 3ns, when measured from 20% to 80% of the pulse amplitude. These modules are capable of driving 70 ECL DC loads. Temperature coefficient of pulse width is less than ±300 ppm/°C over the operating temperature range of -30 to +85°C.

These "DIP series" modules are packaged in a 16-pin DIP housing, molded of flame-proof Diallyl Phthalate per ASTM D 5948, Type SDG-F, and are fully encapsulated in epoxy resin. Leads meet the solderability requirements of MIL-STD-202, Method 208. Corner standoffs on the housing provide positive standoff from the printed circuit board to permit solder-fillet formation and flush cleaning of solder-flux residues for improved reliability.

Marking consists of manufacturer's name, logo (EC²), part number, terminal identification and date code of manufacture. All marking is applied by silk screen process using white epoxy paint in accordance with MIL-STD-130, to meet the permanency of identification required by MIL-STD-202, Method 215.

TEST CONDITIONS

1. All measurements are made at 25°C.
2. Vee supply voltage is maintained at -5.2V DC.
3. All units are tested using a positive input pulse provided by a standard open emitter ECL 10,000 gate. The input and output utilize a 100 ohm pulldown resistor to -2V; the output is also loaded with one ECL 10,000 gate.
4. Input pulse width used is l0ns for all modules; repetition rate is in accordance with the data specified in the Part Number Table.

OPERATING SPECIFICATIONS

Supply Voltage: ................... -5.2V ±5% to Vee
                      (Can be operated on +5V to Vcc)
Supply Current: ................... 56ma typical
Logic 1 Input at 25°C.
     Voltage ...................... -.98V min.
     Current ...................... 265ua max.
Logic 0 Input at 25°C.
     Voltage ...................... -1.63V max
     Current ...................... 0.5ua min.
Logic 1 Output at 25°C ............ -.96V min.
Logic 0 Output at 25°C ............ -1.65V max.
Operating temperature range: ...... -30 to +85°C.
Storage temperature: .............. -55 to +125°C.

PART NUMBER TABLE

Special modules can be readily manufactured to improve accuracies and/or provide customer specified random pulse widths for specific applications.