MULTIPLE LOGIC DELAY LINES

M4DL-ACT-XX

Multi (4) ACT Logic Delay Line

- T²L compatible input and outputs
- Standby power 5 nano watts max.
- Delays stable and precise
- 16-pin DIP package (.300 high)
- Available in delays from 6 to 200ns - each isolated and with 10 T²L fan-out capacity
- Four (4) separate isolated delay lines
- Fast rise time on all outputs

DESIGN NOTES

The "DIP Series" Multiple (4) Logic Delay Lines developed by Engineered Components Company have been designed to provide precise delays with required driving and pick-off circuitry contained in a single 16-pin DIP package compatible with Schottky T²L,advanced CMOS and Fast circuits.These logic delay lines are of hybrid construction utilizing the proven technologies of active integrated circuitry and of passive networks utilizing capacitive, inductive and resistive elements. The MTBF on these modules, when calculated per MIL-HDBK-217 for a 500°C ground fixed environment, is in excess of 1.1 million hours Module design includes compensation for propagation delays and incorporates internal termination at the output. No additional external components are needed to obtain the desired delay.

The M4DL-ACT is offered in 39 delays from 6 to 200ns. Each module includes four (4) separate delay lines, each isolated and fully buffered. Delay tolerances are maintained, as shown in the following Part Number Table, when tested under the "Test Conditions" shown. Delay time is measured at the +1.5V level on the leading edge. Rise time for all modules is 4ns maximum, when measured from 0.75V to 2.4V. Temperature coefficient of delay is approximately +200ppm/øC over the operating temperature range of -40 to +85°C.

These modules accept either logic "1" or logic "0" inputs and reproduce the logic at the output without inversion. The delay modules are intended for use with positive going pulses and are calibrated to the tolerances shown in the table on rising edge delay; in applications using falling edge timing, it is recommended that a special unit be calibrated for the specific application. Each individual delay line has the capability of driving up to 10 T²L loads.

These "DIP Series" modules are packaged in a 16-pin DIP housing, molded of flame-proof Diallyl Phthalate per ASTM D 5948, Type SDG-F, and are fully encapsulated in epoxy resin. Round metal leads meet the solderability requirements of MIL-STD-202, Method 208. Corner standoffs on the housing provide positive standoff from the printed circuit board to permit solder-fillet formation and flush cleaning of solder-flux residues for improved reliability.

Marking consists of manufacturer's name, logo (EC²), part number, terminal identification and date code of manufacture. All marking is applied by silk screen process using white epoxy paint in accordance with MIL-STD-130, to meet the permanency of identification required by MIL-STD-202, Method 215.

TEST CONDITIONS

1. All measurements are made at 25°C.
2. Vcc supply voltage is maintained at 5.0V DC.
3. All units are tested using an ACT toggle-type positive input pulse and one ACT load at the output.
ø4. Input pulse width used is 600ns. Pulse period is 5,000ns.

OPERATING SPECIFICATIONS

* Vcc supply voltage: .......... 4.75 to 5.25V DC
Vcc supply current:
   Constant "1" or "0" in ...... 1 na typical
   Constant 1 Mhz square wave .. 25ma typical
Logic 1 input:
   Voltage ..................... 2V min.; Vcc max.
Logic 0 input:
   Voltage ..................... 0.8V max.
Logic 1 Voltage out: ........... 4.3V min. @ -24ma
Logic 0 Voltage out: ........... 0.44V max. @ +24ma 
Operating temperature range: ... -40 to +85°C.
Storage temperature: ........... -55 to +125°C

* Delays increase or decrease approximately 4% for an increase or decrease of 5% in supply voltage.

PART NUMBER TABLE

ø DELAYS AND TOLERANCES (in ns)

ø All modules can be operated with a minimum input pulse width of 100% of full delay and pulse period approaching square wave; since delay accuracies may be somewhat degraded, it is suggested that the module be evaluated under the intended specific operating conditions.

Special modules can be readily manufactured to improve accuracies and/or provide customer specified random delay times for specific applications.