LOGIC DELAY MODULES

LDM-ACT-XX

ACT Logic Delay Module

- T²L compatible input and outputs
- Standby power 5 nano watts max.
- Delays stable and precise
- 16-pin DIP package (.240 high)
- Available in delays from 10 to 250ns
- 5 outputs - each isolated and with 10 T²L fan-out capacity
- Fast rise time on all outputs

DESIGN NOTES

The "DIP Series" Logic Delay Modules developed by Engineered Components Company have been designed to provide precise tapped delays with required driving and pick-off circuitry contained in a single 16-pin DIP package compatible with Schottky T²L, Advanced CMOS and Fast circuits. These logic delay modules are of hybrid construction utilizing the proven technologies of active integrated circuitry and of passive networks utilizing capacitive, inductive and resistive elements. The MTBF on these modules, when calculated per MIL-HDBK-217 for a 50°C ground fixed environment, is in excess of 1.3 million hours. Module design includes compensation for propagation delays and incorporates internal termination at the output; no additional external components are needed to obtain the desired delay.

The LDM-ACT is offered in twenty-six (26) delays from 10ns to 250ns, with each module incorporating taps as shown in the Part Number Table. Delay tolerances are maintained as shown in the table, when tested under the "Test Conditions" shown. Delay time is measured at the +1.5V level on the leading edge. Rise time for all modules is 4ns maximum when measured from 0.75V to 2.4V. Temperature coefficient of delay is approximately +500 ppm/°C over the operating temperature range of -40 to +85°C.

These modules accept either logic "1" or logic "0" inputs and reproduce the logic at the selected output tap without inversion. The delay modules are intended for use with positive going pulses and are calibrated to the tolerances shown in the table on rising edge delay; in applications using falling edge timing, it is recommended that a special unit be calibrated for the specific application. Each module has the capability of driving up to 20 T²L loads with a maximum of 10 loads on any one tap.

These "DIP Series" modules are packaged in a 16-pin DIP housing, molded of flame-proof Diallyl Phthalate per ASTM D 5948, Type SDG-F, and are fully encapsulated in epoxy resin. Leads meet the solderability requirements of MIL-STD-202, Method 208. Corner standoffs on the housing provide positive standoff from the printed circuit board to permit solder-fillet formation and flush cleaning of solder-flux residues for improved reliability.

Marking consists of manufacturer's name, logo (EC²), part number, terminal identification and date code of manufacture. All marking is applied by silk screen process using white epoxy paint in accordance with MIL-STD-130, to meet the permanency of identification required by MIL-STD-202, Method 215.

TEST CONDITIONS

*1. All measurements are made at 25°C.
2. Vcc supply voltage is maintained at 5.0V DC.
3. All units are tested using an ACT toggle-type positive input pulse and one ACT load at the output being tested.
4. Input pulse width used is 600ns. Pulse period is 5000ns.

OPERATING SPECIFICATIONS

Vcc supply voltage: ............ 4.75 to 5.25V DC
Vcc supply current:
   Constant "1" or "0" in ...... 1na typical
   Constant 1 Mhz square wave .. 4ma typical 
Logic 1 input:
        Voltage ................ 2V min.; Vcc max. 
Logic 0 input:
        Voltage ................ 0.8V max. 
Logic 1 Voltage out: ........... 4.3V min.
                                 @ -24ma 
Logic 0 Voltage out: ........... 0.44V max.
                                 @ +24ma 
Operating temperature range: ... -40 to +85°C.
Storage temperature: ........... -55 to +125°C.

*Delays increase or decrease approximately 2% for an increase or decrease of 5% in supply voltage.

PART NUMBER TABLE

ø DELAYS AND TOLERANCES (in ns)

ø All modules can be operated with a minumum input pulse width of 40% of full delay and pulse period approaching square wave; since delay accuracies may be somewhat degraded, it is suggested that the module be evaulated under the specific operating conditions.

Special modules can be readily manufactured to improve accuracies and/or provide customer specified random delay times for specific applications.